In a significant stride for India's burgeoning semiconductor industry, Kaynes Semicon Pvt Ltd has announced the shipment of the first commercially produced Multi-Chip Module (MCM) manufactured in India to Alpha & Omega Semiconductor (AOS), a U.S.-based company. This achievement, realized under the India Semiconductor Mission 1.0, marks a pivotal moment in the nation's journey towards self-reliance in semiconductor manufacturing.
Kaynes Semicon, a subsidiary of Kaynes Technology India Limited, shipped 900 IPM5 modules from its Outsourced Semiconductor Assembly and Test (OSAT) facility located in Sanand, Gujarat. The IPM5 module is an advanced power device, integrating 17 dies, including Insulated Gate Bipolar Transistors (IGBTs), controller ICs, Fast Recovery Diodes (FRDs), and diodes, into a single, high-performance package. This module is designed for use in various applications across automotive, consumer electronics, industrial automation, and clean energy systems.
This development signifies a breakthrough in India's capacity to assemble and test sophisticated power modules domestically. The strategic collaboration with Alpha & Omega Semiconductor (AOS), a Sunnyvale-headquartered designer, developer and global supplier of power semiconductors, and Mitsui & Co. Ltd. has been crucial in bringing global expertise, supply chain support, and best-in-class manufacturing practices to the project.
Raghu Panicker, CEO of Kaynes Semicon Pvt Ltd, emphasized the significance of this milestone, stating that it reflects the team's dedication, rapid execution, and commitment to quality. He further added that the collaboration aims to establish India as a trusted node in the global semiconductor supply chain.
The Sanand facility, designed for high-volume precision manufacturing, currently operates with a capacity of 6.3 million chips per day. Full-scale mass production is anticipated to commence by January 2026, with plans to scale up to 1.5 million chips per day by the first quarter of fiscal year 2026-27.
This achievement underscores India's increasing maturity in the global OSAT and advanced packaging ecosystem. The project demonstrates how strategic policy support, private-sector execution, and international collaboration can effectively translate India's semiconductor vision into tangible results. The facility was set up with an investment of Rs 1653.5 crore from the Centre under the India Semiconductor Mission 1.0 (ISM).
This initial shipment of the India-made chip module to AOS represents a significant step forward in realizing the vision of "Make in India" in the critical sector of semiconductor manufacturing. It also strengthens the economic and strategic partnership between India and the United States in high-tech manufacturing.
